Litho Process EVG Model 620 w/BSA - Status: In Use
  • Current Status: In Use
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $68.25/Hour
    • External Affiliated Commercial/Industrial: $68.25/Hour
    • External Commercial/Industrial: $91.00/Hour
    • External International Academic: $91.00/Hour
    • Internal Standard: $45.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Photolithography (165)
  • In Cleanroom: Yes
  • Main Contact: Bill Lewis
 The EVG 620 is a double-side mask aligner and it can be used for UV lithography on wafers of sizes up to 150mm.

The lamp is OFF (contact Staff if you need to use the tool)

Photolithography wiki link
Photoresist wiki link
Microfabrication wiki linkLatest Status Log EntryApr 12, 2024 - Resource Status Up - up for bonding only
Capabilities Training Prerequisites Calendar Contacts Docs

The EVG 620 is a double-side mask aligner and it can be used for UV lithography on wafers of sizes up to 150mm. It has options for soft contact, hard contact and proximity exposure. It has +/- 1 um front-to backside alignment accuracy and also a Bond alignment capability. Advanced notification must be sent before the machine can be used.

The DOWN Status most of the time indicates the lamp needs to be turned on. Contact NRF Staff owner by phone when you want to use the aligner.

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